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Reballer Kit

About the Reballer Kit

This kit is used to reball UFS chips and EMMC/EMCP chips.

Kit includes:

  • BGA reballing station Chip holder repair base
  • 500 g Lead Free SMT low heat solder paste
  • Aluminium Foil Tape
  • 4 Stencils for BGA221, BGA529, BGA169/162, UFS BGA95

Watch mobile forensic expert Bob Elder walk you through the 2 stage reballing-tinning process of BGA Chips. 

The Teel Tech Canada Reballing Kit Includes

Reballing Stencils

Low-temp Lead-free SMT Solder Paste

Aluminum Foil Tape

BGA Reballing Station