Enabling Mobile Device Forensics
The unstoppable move on communications and computing to mobile devices creates ever new challenges for digital forensics. New levels of device encryption across a range of hardware and software platforms requires new, high accuracy, high yield chip-access techniques.
Advanced Chip-Off Techniques
For the collection of hard-to-access digital evidence. ULTRA TEC provides a suite of tools for advanced chip-off, de-lidding, decapsulations and surface preparation. Using market-tested mechanical and chemical techniques, our systems enable access to board, module and component-level devices for subsequent electrical and optical analysis.
Using the non-heat polishing process to remove epoxy from a BGA chip removed from an Android cell phone. The process also includes the use of the Planar Fixture to ensure accuracy in the polishing process.