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About the Reballer Kit

Reballer-KitProduct Code: AP-REBALL-KIT
This kit is used to reball UFS chips and EMMC/EMCP chips.

Kit includes:

  • BGA reballing station Chip holder repair base
  • 500 g Lead Free SMT low heat solder paste
  • Aluminium Foil Tape
  • 4 Stencils for BGA221, BGA529, BGA169/162, UFS BGA95

A Preview of the Reballing-Tinning Process and Polishing

Watch mobile forensic expert Bob Elder walk you through the 2 stage reballing-tinning process of BGA Chips. This is just a small example of some of the techniques you’ll learn when you register for the Advanced BGA Chip-off course through Teel Tech Canada.





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