Reball Kit

 Teel Tech Canada Reball Kit

Product Code: AP-REBALL-KIT

The Teel Tech Canada Reball kit is perfect for technicians wanting to reball UFS and EMMC/EMCP chips.

This kit includes:

• 90mm Diagonal BGA Ball Mounting Table for Chip Rework Repair
• Martview RB-01 Reballing Stencil (Full Set for EMMC / EMCP / UFS BGA153 / 162 / 169 / 186 / 221 / 254) with Fixed Plate and Magnetic Base Holder.
• Stainless Steel Sealing Scraper Solder Paste Tool for Phone Repair
• 50g Low Temperature Solder Paste Flux For BGA Stencil Reballing.
• MaAnt Ultra Thin Stainless Steel Remove Glue Blade Set
• 2uFix Degumming Repairing Bent Blade Set for Mobile Phone Screen De-bonding / Removal