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Reballer Kit

About the Reballer Kit

Product Code: AP-REBALL-KIT
This kit is used to reball UFS chips and EMMC/EMCP chips.

Kit includes:

  • BGA reballing station Chip holder with magnetic repair base
  • 500 g Lead Free SMT low heat solder paste
  • Stencils for BGA153, BGA162, BGA169, BGA186, BGA221, BGA254.

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