About the Reballer Kit
Product Code: AP-REBALL-KIT
This kit is used to reball UFS chips and EMMC/EMCP chips.
- BGA reballing station Chip holder repair base
- 500 g Lead Free SMT low heat solder paste
- Aluminium Foil Tape
- 4 Stencils for BGA221, BGA529, BGA169/162, UFS BGA95
A Preview of the Reballing-Tinning Process and Polishing
Watch mobile forensic expert Bob Elder walk you through the 2 stage reballing-tinning process of BGA Chips. This is just a small example of some of the techniques you’ll learn when you register for the Advanced BGA Chip-off course through Teel Tech Canada.